CXMT Launches Global Campus Recruitment with Over 180 Open Positions

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On September 1st, the official “CXMT Recruitment” WeChat account announced that CXMT’s 2027 global campus recruitment is officially underway. Open positions span circuit design, R&D technology, mass production technology, production operations, information technology, marketing, and business enablement. Work locations include Hefei, Beijing, Shanghai, Xi’an, and Japan.

This recruitment drive targets 2027 graduates from universities worldwide, with majors covering microelectronics, communications, circuit design, semiconductor design, integrated circuits, mathematics, computer science, physics, chemistry, circuit systems, electronic engineering, electronic information, materials, artificial intelligence, and more. As for compensation and benefits, the package includes base salary, shift allowances (for certain positions), quarterly bonuses, and year-end bonuses.

According to NUPIAO’s check of the CXMT campus recruitment official website, the company has over 180 open positions, with R&D technology roles being the most numerous, followed by production operations. The majority of positions are based in Hefei.

Looking at the job requirements, take the AI Researcher position for example: it requires a master’s degree or above, with PhD candidates preferred. The preferred majors include microelectronics, integrated circuits, electronic engineering, computer science, AI, automation, data science, software engineering, materials, physics, mathematics, and related fields. Candidates with interdisciplinary backgrounds are strongly encouraged to apply.

Other requirements include: hands-on AI experience—having personally trained deep learning models using PyTorch or TensorFlow and understanding core challenges like overfitting, distribution shift, and sparse rewards; or having built an Agent or RAG system based on LangChain or LlamaIndex and solved real-world engineering problems with it; or possessing EDA or semiconductor scenario comprehension skills—being able to read a DRAM process paper, understand an EDA script’s logic, or interpret a yield statistics report and identify potential improvement points within the first week of joining. Candidates must satisfy at least two of these requirements.

The AI Researcher’s responsibilities include: restructuring and forward-looking definition of the EDA toolchain, evaluating and importing world-class advanced EDA tools, conducting functional analysis and underlying optimization for special process nodes, building simulation, verification, and physical implementation tool prototypes from scratch for next-generation process platforms, collaborating with universities and research institutes to drive technology roadmaps, leading the intelligent promotion of EDA domestication within design teams, and using Agents to automatically identify design weaknesses and recommend optimization solutions.

CXMT is an integrated memory manufacturer focused on the design, R&D, production, and sales of Dynamic Random Access Memory (DRAM) chips. Founded in 2016 and headquartered in Hefei, Anhui, CXMT operates multiple R&D centers and branch offices both domestically and internationally. The company’s technical team possesses extensive R&D experience and innovation capabilities, having launched multiple commercial DRAM products widely used in mobile devices, computers, servers, virtual reality, and the Internet of Things.

On July 27th, CXMT’s parent company, ChangXin Technology (688825.SH), officially debuted on the STAR Market. It opened at 49.5 yuan per share, surging 471.59% from its IPO price of 8.66 yuan, with an opening market value of approximately 3.31 trillion yuan—securing the top spot on the A-share market’s total market value rankings.

The latest semi-annual report shows that CXMT generated operating revenue of 150.31 billion yuan in the first half of the year, a year-on-year increase of 873.64%; net profit attributable to parent company reached 77.605 billion yuan, turning from loss to profit year-on-year. Q2 net profit alone was 52.843 billion yuan, up 113% quarter-over-quarter, exceeding the company’s earlier expectations.

The company attributed its remarkable growth primarily to the rapid surge in global computing power demand, the supply shortage of DRAM products, and significant price increases. R&D investment in the first half reached 6.859 billion yuan, up 87.38% year-on-year.

Earlier reports suggested that Apple, in an effort to ease manufacturing cost pressure for its next-generation iPhones and other smart devices, had negotiated supply prices for mobile DRAM such as LPDDR5X with CXMT—but its request for price cuts was turned down. CXMT’s asking price was actually higher than Samsung Electronics and SK Hynix, or at least on par with both.

The reason CXMT refused to budge on pricing is that Chinese domestic companies like Huawei and Xiaomi have already locked in CXMT’s production capacity through long-term contracts, so CXMT has no need to accommodate Apple’s demanding terms. Back in June of this year, Apple officially announced price increases for its iPad and Mac product lines due to the relentless surge in memory and storage chip costs.

According to CXMT’s prospectus, the company has established partnerships with core industry clients including Tencent, Alibaba Cloud, ByteDance, Lenovo, and Xiaomi.

Right now, CXMT is in aggressive expansion mode. The company has formed a dual-base layout for 12-inch DRAM wafer manufacturing in Hefei and Beijing. By the end of 2026, the company’s monthly wafer input capacity is expected to exceed 300,000 wafers—roughly three times the production scale of domestic second-tier DRAM manufacturers.

As of early 2026, CXMT operates three 12-inch DRAM wafer fabs in Hefei and Beijing, with a monthly capacity of approximately 280,000 to 300,000 wafers, and capacity utilization has consistently remained above 95%. By the end of 2026, CXMT’s monthly capacity is projected to rise to about 350,000 wafers, approaching the estimated capacity of Micron—one of the world’s top three memory makers—which sits at around 385,000 wafers. CXMT’s long-term goal is to achieve a monthly capacity of 600,000 wafers. At the current expansion pace, the company is poised to surpass Micron in overall production scale around 2030.

The company announced on August 29th that its LPDDR6 memory has officially entered mass production. Lei Jun, founder, chairman, and CEO of Xiaomi, posted on Weibo: “Congratulations to CXMT on achieving LPDDR6 memory mass production—truly remarkable! The Xuanjie O3 is the first to support CXMT’s LPDDR6, and the Xiaomi 18 Fold debuts with it. I believe this is just the beginning—more outstanding Chinese tech companies will join forces and scale new heights!”

In its semi-annual report, CXMT noted that its self-developed LPDDR6 chip delivers a comprehensive performance leap over the previous-generation LPDDR5X, with peak data rates reaching 12,800 Mbps and maximum chip capacity of 16GB. The product has already been sent to key customers for validation and is currently accelerating toward full-scale mass production.

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