Samsung Responds to Plans for Nearly 90 Trillion Won Stock Buyback for Bonuses
On June 24, Samsung Electronics confirmed in regulatory filings that it is indeed considering buying back shares for employee compensation based on 2026 performance results. However, they clarified that specific timelines and exact amounts haven’t been finalized yet. The company stated these discussions are ongoing, with a formal announcement expected within the next month at the latest.
Earlier reports suggested Samsung was preparing to repurchase nearly 90 trillion won worth of stocks specifically to fund employee bonuses, with details potentially being revealed very soon.
Apple Expected to Start Mass Production of First Foldable iPhone in Late July
According to supply chain insiders, Apple has locked in the key specs for its foldable iPhone—including the display, casing, and mechanical components—and is now in the final stages of mass production preparation. Production is slated to kick off in late July. While recent rumors hinted at potential delays due to hinge issues, sources indicate Apple will stick to its original schedule and unveil the device this September as planned.
Nvidia Pushing PCB Prices Down by 10%? Wingtech Technology Says Client Adjustments Are Normal
On June 23, the PCB (printed circuit board) sector took a major hit, with industry leader Wingtech Technology seeing its stock plummet over 7% in a single day. Reports from Shanghai Securities News link this drop to two main market rumors: one claiming Nvidia demanded a 10% price cut from PCB suppliers, and another suggesting Wingtech’s expansion plans were hampering shipments for Nvidia’s Rubin platform.
On June 24, a spokesperson for Wingtech Technology told The Paper that while there are countless rumors circulating, the company can’t address every single one. They emphasized that business operations remain completely normal and fundamentals haven’t changed. “Client solutions aren’t set in stone; adjustments and improvements during production are totally standard,” the spokesperson noted, adding that Wingtech still holds significant first-mover advantages. Investors should be careful to distinguish between rumors and official company disclosures.
SK Hynix Has Filed for US IPO
Documents filed with the U.S. Securities and Exchange Commission on June 24 reveal that SK Hynix has officially applied for an Initial Public Offering (IPO) on the NASDAQ under the ticker symbol “SKHY.” Major investment banks including Bank of America, Citigroup, Goldman Sachs, and JPMorgan Chase have been appointed as underwriters. The funds raised will be directed toward building semiconductor clusters in Yongin, advanced packaging facilities in Cheongju, and purchasing EUV lithography equipment.
Sunjiro: Building the World’s Largest Data Center
During a shareholders meeting on June 24, SoftBank Group Chairman Masayoshi Son addressed questions about data center investments. He revealed he’s currently signing memorandums of understanding with a client for a development project in Ohio, USA. Son explained that if this deal goes through, “this single venture alone could generate massive profits.” When discussing power consumption for these centers, he mentioned that SoftBank Energy is pushing forward the Ohio project, stating, “A single facility will provide power equivalent to 10 nuclear plants,” aiming to “build the world’s largest data center.”
Additionally, Son shared that Arm, the UK-based chip design firm under SoftBank, is evolving from just designing chips to actually manufacturing them. He predicted that “the future AI era will be CPU-centric” and highlighted that Arm still has “more than 10x growth potential.” He also touched upon SoftBank’s roughly 300 billion yen investment in Intel, noting, “It faced criticism back then, but today, the profit based on market cap has reached several trillion yen.”
Xiaomi Smart Storage Officially Announced: 4TB Version Crowdfunding Price Hits 2,299 Yuan
On June 24, Xiaomi officially launched its new Smart Storage line, opening pre-orders via the Xiaomi Mall and Xiaomi Youpin crowdfunding platforms. Pricing highlights include: the 4TB version at 2,299 yuan for crowdfunding (retail price 3,499 yuan), the 8TB version at 2,899 yuan for crowdfunding (retail price 4,499 yuan), and the massive 16TB version at 4,699 yuan for crowdfunding (retail price 6,999 yuan).
TSMC Advanced Process Node Foundry Services May See Across-the-Board Price Hikes
On June 24, tech analyst Tim Culpan reported that TSMC has begun notifying clients about upcoming price increases for wafer foundry services. This isn’t limited to the rumored 3nm process; the hike covers all advanced nodes down to 7nm and below. The overall increase is estimated between 5% to 10%, affecting approximately 75% of TSMC’s total wafer revenue.
Hon Hai and Sharp Sign Strategic Partnership Focused on AI Infrastructure and Robotics
On June 24, Hon Hai Precision Industry Co., Ltd. (Foxconn) and Sharp announced the signing of a strategic cooperation memorandum. Both parties will establish a joint R&D and commercialization framework to explore new business opportunities in areas like AI infrastructure, energy and ESG, robotics and intelligent automation, next-generation communications, and smart cities.
